Influence of Electric Field Strength of Wire Surface on Creeping Discharges along Aerial Insulated Wire

Overview of wire bonding using copper wire or insulated wire

Wire bonding using copper or insulated wire leads to many advantages and new challenges. Research is intensively performed worldwide, leading to many new findings and solutions. This article reviews recent advances in wire bonding using copper wire or insulated wire for advanced microelectronics packaging. Journal articles, conference articles and patents published or issued recently are review...

Effects of Electron Beam Irradiation on Properties of ETFE Insulated Electric Wire

Experimental Investigation of Surface Roughness and Kerf Width During Machining of Blanking Die Material on Wire Electric Discharge Machine

Wire electric discharge machine (WEDM) is spark erosion in unconventional machining technique to cut hard and the conductive material with a wire as an electrode. The blanking die material SKD 11 is a high carbon and high chromium tool steel with high hardness and high wearing resistance property. This tool steel has broad application in press tools and dies making industries. In this research ...

Prediction of Surface Roughness in Wire Electric Discharge Machining (WEDM) Process based on Response Surface Methodology

This paper presents an investigation on WEDM of pure titanium (grade-2). An attempt has been made to model the response variable i.e. surface roughness in WEDM process using response surface methodology. The experimental plan is based on Box-Behnken design. Six parameters i.e. pulse on time, pulse off time, peak current, spark gap voltage, wire feed and wire tension has been varied to investiga...

Two capillary solutions for ultra-fine-pitch wire bonding and insulated wire bonding

In this article, the new challenges and requirements in wire bonding are discussed, the problems in ultra-fine-pitch wire bonding and insulated wire bonding are analyzed, and then two capillary solutions to the problems are presented. Actual bonding experiments using the new capillaries were carried out and the results were satisfactory. Compared to the standard design, a new capillary design h...